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Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max


Price:
$3.36

Free Shipping

Description

1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design

Specification:
Package Weight
One Package Weight 0.05kgs / 0.11lb
Qty per Carton 180
Carton Weight 8.20kgs / 18.08lb
Carton Size 40cm * 32cm * 32cm / 15.75inch * 12.6inch * 12.6inch
Loading Container 20GP: 651 cartons * 180 pcs = 117180 pcs
40HQ: 1511 cartons * 180 pcs = 271980 pcs

More Pictures

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SPT0139